The plan view is a cloud (lib.form.cloud_outline): flat edge on the -Y power side, straight sides at +X (Ethernet) and -X (SD end), round lobes along the +Y GPIO edge. Walls are vertical; the body's outer skin carries a soft noise texture (lib.form.textured) and the lid's top edge is chamfered so the silhouette reads soft from every side.

Body: four M2.5 heat-set standoffs at the Pi 5 hole pattern (Pi screwed down from above), vent slots in the floor under the board, four rubber-foot recesses, and three windows cut with lib.patterns.pi.pi5_port_cutouts: USB-C (power, -Y flat wall), Ethernet (+X wall) and the 40-way GPIO ribbon (+Y lobed wall). The ribbon opening is a NOTCH from the ribbon slot height up through the rim, closed by the lid: the IDC socket sits inside the lobes and the assembled cable drops into the notch before the lid goes on (a closed window that high would leave < 1 mm of wall above it). micro-HDMI, USB-A and the microSD slot are CLOSED (add "hdmi0"/"hdmi1" to POWER_PORTS, "usb_a_lower"/"usb_a_upper" to USB_PORTS, or an "sd" cut, in params.py). Lid: cloud plate with a 3 mm lip dropping inside the walls (0.25 mm slip fit per side), lip interrupted over the ribbon notch, vent slots over the SoC, 1.5 mm top chamfer; no screws.

Hardware: Raspberry Pi 5 (bare or with a heatsink <= 20 mm; the Active Cooler at 13.7 fits), 4x M2.5 brass heat-set inserts, 4x M2.5 x 6 screws, 4x 10 mm stick-on rubber feet (optional), a 40-way IDC ribbon cable on the GPIO header exiting through the +Y window.

Pipeline: the body is built exactly in B-rep (outline, walls, bosses, windows, vents, feet) and handed to lib.form.textured LAST; the exterior-only, horizontal displacement leaves the bed face, the rim height, the cavity, bosses, holes and windows untouched, so the lid fit and the Pi fit are the B-rep ones. The body exports STL / 3MF (no STEP); the lid is B-rep.

Print orientation: body floor on the bed, lid top face on the bed (returned already flipped). Windows are bridged by the wall above them (<= 18 mm spans). Material: PLA or PETG.

Assumptions (user unavailable): headless use, so only power, Ethernet and GPIO are open; a +Y clearance of 14 mm so the IDC socket and its strain relief sit inside the lobes; standoffs use a 1.2 mm insert wall (OD 6.4) to respect the component keep-out around the Pi holes.